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Multilayer board processing Stack

Innerlayers of multilayer boards can shift during fabrication processes and create poor layer-to-layer alignment. During the artwork exposure or fabrication of the multilayer boards, the position of the copper shifts relative to the nominal stacked position. This can create breakout or missing of the copper pads when drUhng the interconnection holes. [Pg.577]


See other pages where Multilayer board processing Stack is mentioned: [Pg.111]    [Pg.111]    [Pg.25]    [Pg.111]    [Pg.1614]    [Pg.87]    [Pg.2765]    [Pg.921]   
See also in sourсe #XX -- [ Pg.27 , Pg.35 ]




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