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Moly-manganese

Alumina ceramics are used wherever exceptionally good dielectric properties, high mechanical strength and high thermal conductivity, coupled with a reliable ceramic-metal joining technology such as the moly-manganese process, are demanded. Examples of components are illustrated in Fig. 5.25. [Pg.283]

High-temperature cofired ceramic (HTCC) packages make use of thermal vias in the same manner as in multilayer thick-film substrates. The via-fill material used in HTCC packages is a refractory material such as tungsten or moly-manganese. [Pg.137]

The high temperature required to sinter the ceramic requires that the conductors be refractory metals. Tungsten or a mixture of molybdenum and manganese, moly-manganese, is used. These metals have an electrical resistance approximately 3 times that of copper, gold. [Pg.37]

See other pages where Moly-manganese is mentioned: [Pg.283]    [Pg.285]    [Pg.362]    [Pg.363]    [Pg.388]    [Pg.38]    [Pg.206]    [Pg.274]    [Pg.38]    [Pg.129]    [Pg.283]    [Pg.285]    [Pg.362]    [Pg.363]    [Pg.388]    [Pg.38]    [Pg.206]    [Pg.274]    [Pg.38]    [Pg.129]    [Pg.71]    [Pg.637]    [Pg.101]    [Pg.71]    [Pg.395]    [Pg.805]   
See also in sourсe #XX -- [ Pg.119 , Pg.283 ]



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