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Microhotplate with MOS-Transistor Heater

After the deposition of the passivation, the contact electrodes for the resistive measurements have to be opened (Fig. 4.14f). The respective nitride etching was done in a reactive-ion etcher under SFe atmosphere. [Pg.49]

The membrane release and the deposition of the sensitive layer are identical with the process described in Sect. 4.1.2. [Pg.49]


Fig.4.17. Cross-section of a microhotplate with integrated MOS-transistor heater, D and S denote drain and soiu ce of the transistor... Fig.4.17. Cross-section of a microhotplate with integrated MOS-transistor heater, D and S denote drain and soiu ce of the transistor...

See other pages where Microhotplate with MOS-Transistor Heater is mentioned: [Pg.49]    [Pg.49]    [Pg.51]    [Pg.53]    [Pg.55]    [Pg.57]    [Pg.99]    [Pg.100]    [Pg.49]    [Pg.49]    [Pg.51]    [Pg.53]    [Pg.55]    [Pg.57]    [Pg.99]    [Pg.100]    [Pg.4]    [Pg.98]   


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