Microelectronic corrosion integrated circuits

To avoid surface corrosion processes, the microelectronic industry takes three precautions it avoids the use of solvents and reagents that may leave an ionic residue on the microcircuits it encapsulates the integrated circuits and it packages the microcircuits in plastic containers. When used in weapons, in space, or in undersea communi... 

TiN. owing to its unique combination of properties, is used extensively as a coating on. structural materials to improve their resistance to heat, wear and corrosion. It is also widely u.sed as a decorative coating on various surfaces. Another important field of application of TiN is in microelectronics, as diffusion barriers in VLSI-MOS integrated circuits. 

A basecoat can provide a new and better surface for the deposition of the desired material. This is often done in the metallization systems used in microelectronics and for interconnects in integrated circuit (IC) technology. In these cases, a material is deposited on the oxide/semiconductor surface that forms a desirable oxide interface (e.g. Ti or Cr). Then, a surface layer material is deposited, which alloys with the first layer and provides the desired electrical conductivity, bondability, corrosion resistance, etc. (e.g. Au, Cu, Ag). 

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