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Metal digital deposition

Fig. 4.17. The process flow used in [79]. The hrst three layers are deposited using conventional blanket deposition techniques and are patterned using the digital lithography process shown in Fig. 4.16. The metal layers are thermally evaporated and the nitride/oxide composite layer is deposited using PECVD. After treatment of the stack with octadecyltrichlorosilane to passivate the surface the semiconductor is deposited additively using a jet printer from solution and dried. Fig. 4.17. The process flow used in [79]. The hrst three layers are deposited using conventional blanket deposition techniques and are patterned using the digital lithography process shown in Fig. 4.16. The metal layers are thermally evaporated and the nitride/oxide composite layer is deposited using PECVD. After treatment of the stack with octadecyltrichlorosilane to passivate the surface the semiconductor is deposited additively using a jet printer from solution and dried.
Figure 13.22. Experimental setup for electro-deposition of metals with two parallel electrodes A and C 5 cm apart, B = DC battery, R = rheostat and M = digital multimeter [52]. Figure 13.22. Experimental setup for electro-deposition of metals with two parallel electrodes A and C 5 cm apart, B = DC battery, R = rheostat and M = digital multimeter [52].

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