MCOT

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A fourth generation of electrically conductive adhesives based on cyanate esters and modified cyclo-olefin thermoset (MCOT) resins was introduced in the 1990s. These resins were specially formulated for low moisture absorption, high thermal stability, and low stress to be compatible with solder-reflow conditions. They were developed to prevent or reduce the so-called popcorn effect, a failure mode attributed... 

Cyanate ester and MCOT adhesives introduced for low moisture absorption, compatihle with solder-reflow temperatures (popcorn resistant)... 

Modified cyclo-olefin thermosets (MCOT) for chip attachments requiring very low moisture absorption. 

Modified cyclo-olefin thermoset (MCOT) resins are liquids that cure when heated at 150 °C for a minimum of 30 minutes to form the general polymer structure shown in Figure 3.14. The monomers cure by an addition polymerization and, as such, no water or other by-products are evolved. The molecular structures are essentially nonpolar which impart very low moisture absorption properties. For two formulations developed by Johnson-Matthey, water absorptions of 0.05% were recorded when exposed to 85 °C/85% RH conditions for 168 hours. Only 0.1% water absorption was measured even after pressure cooker testing at 150 °C, 85% RH, for 168 hours. These low moisture absorption values make MCOT adhesives and molding... 

Figure 3.14 Modified cyclo-olefin thermoset (MCOT) polymer structure.

CSP Ultralow MOE, stress and thermoset (MCOT), silicone materials, highly filled thermally conductive adhesives Epoxy blends, cyanate-ester... 

Modified cyclo-olefin thermoset (MCOT) technology Low moisture absorption. Reduced popcoming. Excellent adhesion. Marginal adhesion to some substrates. 

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