Materials Thermosetting Aromatic Dielectric Material

Assignee The Board of Trustees of the University of Illinois (Urbana, IL) 

Although minimization in integrated circuits allows for faster device operation, propagation delays increase with increasing numbers of interconnects. To address this problem, lower dielectric constant materials have been prepared. 

A reaction flask was charged with 3-ethynyl phenol (0.017 mol), 5 ml of pyridine, and 20 ml of CH2CI2 and treated with the dropwise addition of 1,3,5-benzenetricarboxylic acid chloride (0.0055 mol) dissolved in 10 ml of CH2CI2 and refluxed for 6 hours at 45°C. The resulting yellow solution was washed 3 times apiece with 20 ml of 1M HCl, IMNaOH, and water. The mixture was then dried withNa2S04, filtered, concentrated, and the product was isolated as a yellow powder in 58% yield. 

Preparation of Poly[3-Diethynyl Benzene-co-(tris-(3-Ethynyl-Phenyl) Trimesate)] 

A second derivative was also prepared as shown below. 

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