Loading with dough

The C-C, C-SiC, and Cu-clad-Mo plates were sliced into 2.54 cm x 1.27 cm x 0.25 cm pieces, and ultrasonically cleaned in acetone for 15 min. prior to brazing. Braze powders were mixed with glycerine in a viscous paste with dough-like consistency, and a small (-0.2 g) quantity of this paste was applied to the joint region between the composite and metal. The sandwiched composite/braze/metal structure was placed under -6.0 kPa pressure (2.0 N load) in a vacuum furnace which was heated to the brazing temperature (-20°C above Tl) under a pressure of 10 torr. After a 5 min. soak at the brazing temperature, the assembly was slowly cooled at a controlled rate ( 5°C per min.) to 400°C, followed by furnace cooling. 

Semibatch processes are also important in solids processing such as in foods and microelectronics, where it is more practical to load the reactor with a batch of solids (bread dough or silicon wafers) and subject the solids to heat and gas or liquid reactants. The processed solids are then withdrawn after a suitable time, and the reactor is reloaded. 

FIGURE 6.11 Second loading vector and calibration vector of sucrose for the biscuit dough data set, computed with (a) second loading of vector and (b) calibration vector of sucrose for the biscuit dough data set, computed with CPCR and RPCR [61]. 

This is a process for loading paper, tin or metallic cases with a composition and one of the processes of shaping. There are two ways to load the composition as pov/der and to load it as a dough. 

Machines — All types with uniform non reversing loads Food industry Beet slicers, dough Hammer mills... 

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