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Liquid Injected Plasma Deposition

FIGURE 2.2 Schematic of Liquid Injected Plasma Deposition technique. [Pg.45]

FIGURE 2.3 Equipment in use at INL for Liquid Injected Plasma Deposition. [Pg.45]

Chemical vapor deposition refers to the formation of a nonvolatile solid material from the reaction of chemical reactants, called precursors, being in vapor phase in the right constituents. A reaction chamber is used for this process, into which the reactant gases are introduced to decompose and react with the substrate to form thin film or powders There are several main classification schemes for chemical vapor deposition processes. These include classification by the pressure (atmospheric, low-pressure, or ultrahigh vacuum), characteristics of the vapor (aerosol or direct liquid injection), or plasma processing type (microwave plasma-assisted deposition, plasma-enhanced deposition, remote plasma-enhanced deposition)... [Pg.395]


See other pages where Liquid Injected Plasma Deposition is mentioned: [Pg.44]    [Pg.44]    [Pg.159]    [Pg.71]    [Pg.375]    [Pg.340]    [Pg.302]    [Pg.66]    [Pg.268]    [Pg.183]    [Pg.187]    [Pg.188]    [Pg.189]    [Pg.158]    [Pg.485]    [Pg.507]    [Pg.352]    [Pg.492]    [Pg.352]    [Pg.252]    [Pg.76]    [Pg.124]    [Pg.212]   
See also in sourсe #XX -- [ Pg.44 ]




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