Interstitial point defects interstitialcy diffusion mechanism

Solid-state diffusion, which is involved in the release of oxygen, proceeds generally through the movement of point defects. The vacancy mechanism, the interstitial mechanism, and the interstitialcy mechanism can occur depending on the distortion of the solid lattice and the nature of the diffusing species. When one of the steps 1-5 is the slowest step representing the major resistance, that step is the rate-controlling one, which is not necessarily the chemical reaction (step 3). 

Diffusion by the interstitial mechanism and by the interstitialcy mechanism are quite different processes and should not be confused. Diffusion by the vacancy and interstitialcy mechanisms requires the presence of point defects in the system, whereas diffusion by the ring and interstitial mechanisms does not. 

Point Defect Generation During Phosphorus Diffusion. At Concentrations above the Solid Solubility Limit. The mechanism for the diffusion of phosphorus in silicon is still a subject of interest. Hu et al. (46) reviewed the models of phosphorus diffusion in silicon and proposed a dual va-cancy-interstitialcy mechanism. This mechanism was previously applied by Hu (38) to explain oxidation-enhanced diffusion. Harris and Antoniadis (47) studied silicon self-interstitial supersaturation during phosphorus diffusion and observed an enhanced diffusion of the arsenic buried layer under the phosphorus diffusion layer and a retarded diffusion of the antimony buried layer. From these results they concluded that during the diffusion of predeposited phosphorus, the concentration of silicon self-interstitials was enhanced and the vacancy concentration was reduced. They ruled out the possibility that the increase in the concentration of silicon self-interstitials was due to the oxidation of silicon, which was concurrent with the phosphorus predeposition process. 

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