Imidazole, epoxy molding compound

From the up-to-date literature and patent review of catalysts used In anhydride and phenolic cured epoxy molding compounds, It Is evident that Imidazoles and their derivatives predominate (Table I). Metal complex, trialkyl or triaryl phosphines and their complexes, Lewis acids such as zinc or stannous octoate are used to a much lesser extent (Table II). There are a few examples of tertiary amines and urea derivatives used. 

The mechanism for organometallics and Lewis acids in phenolic or anhydride cured epoxy molding compounds are still not fully understood. Lewis bases such as imidazoles can be reacted with organic acids to form salts in order to improve latency. Imidazoles are, so far, the most widely accepted as a compatible catalyst family for encapsulating microelectronics. 

Diaminodiphenyl sulfone curing agent, epoxies molding compounds 2-Phenyl imidazole... 

AI3-50034 EINECS 211-581-7 Imidazole, 2-phenyl- IH-lmidazole, 2-phenyl- NSC 255226 Phenylimidazole 2-Phenylimidazole 2-Phenyl-IH-imidazole. Epoxy curing agent for printed circuit boards, molding compounds, potting accelerator for dicyandiamide and anhydrides. Leaflets mp = 1469.3° bp = 340° insoluble in H2O, very soluble in EtOH. BASF Cap. Janssen Chimica Lancaster Synthesis Co. 

Imidazole-cured resins are vindely used in the electronics industry as molding and sealing compounds because they exhibit better heat resistance, less tensile elongation, higher modulus, and a vwder range of cure temperatures than amine-cured epoxy [98-100]. 

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