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High density integration

High thermal conductivity CVD-diamondfilms deposited on heat spreaders or heat slugs to dissipate the heat of high-density integrated circuits. [Pg.26]

FRAM engineering, particularly for high-density integration, is very well reviewed in [1,2]. The state of the art is illustrated in Fig. 1 from Samsung. [Pg.199]

Kim K (2004) High density integration. In Ishiwara H, Okuyama M, Arimoto Y (eds) Ferroelectric random access memories. Top Appl Phys 93 165-176... [Pg.208]

High density integration of memory cells and complex circuits... [Pg.382]

Ruthenium silicides are of interest for manufacturing high-density integrated circuit devices since they have a very good lattice match with silicon and relatively low electrical resistance. Other potential applications are in light emitting diodes and thermoelectrical devices. [Pg.372]

See other pages where High density integration is mentioned: [Pg.419]    [Pg.365]    [Pg.284]    [Pg.372]    [Pg.37]    [Pg.365]    [Pg.306]    [Pg.364]    [Pg.385]    [Pg.273]    [Pg.208]    [Pg.152]    [Pg.15]    [Pg.2087]    [Pg.453]    [Pg.306]    [Pg.520]    [Pg.272]    [Pg.193]    [Pg.215]   
See also in sourсe #XX -- [ Pg.382 ]



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