Grinding brittle fracture energy

HPSN. This same argument would also apply to all the other workpiece materials as listed in Table 3.1 with the possible exception of RBSN. Therefore, most of the grinding energy must be expended by ductile flow, even though material removal is mainly by brittle fracture. 

Specific grinding energy (top) and area percent grinding-induced surface fracture (bottom) vs. the grain depth-of-cut to the -4/3 power for CVD silicon carbide. Tomita, Y. and Eda, H., Development of new bonding materials for fixed abrasive of grinding stone instead of free abrasives processing. Bull JSPE (in Japanese), 61, 10 (1995) 1428 Lawn, B.R. and Swain, M.V., Microfracture beneath point indentations in brittle solids, J Mater Sci, 10 (1975) 113. 

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