Grain boundaries spark plasma sintering

In SPS process, grain growth is suppressed by rapid heating and the densification is accelerated at high temperamre. UHTCs densified by spark plasma sintering usually have higher densities, refined microstructures, clean grain boundaries as well as an overall improvement in the materials performance. In SPS, the temperature measured on the die surface is lower than the actual sample. The difference in temperature depends on the size of the die, level of vacuum and insulation. 

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