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Gold metallizations, contaminant-free

Deposits from the sulfate or phosphate are hard (900 to 1000 Knoop), highly reflective, extremely corrosion-resistant, and highly conductive (resistivity is 4.51 pi/cm). Rhodium plate is used where a low-resistance, long-wear, oxide-free contact is required. In addition, rhodium as a deposit on nickel for edge connectors has been replaced by gold.This is due to difficulty in bath control problems with organic and metallic contaminants, as weU as cost. Table 29.12 shows details of rhodium plating. [Pg.718]


See other pages where Gold metallizations, contaminant-free is mentioned: [Pg.17]    [Pg.248]    [Pg.145]    [Pg.199]    [Pg.137]    [Pg.208]    [Pg.435]    [Pg.245]    [Pg.1033]    [Pg.116]    [Pg.378]    [Pg.16]    [Pg.420]   
See also in sourсe #XX -- [ Pg.457 ]




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Contamination free

Free metal

Gold metal

Metal contamination

Metallic contamination

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