Function and Consumption

Quantifying the Effects of Competitive Adsorption on Metal Deposition 

A detailed understanding of competitive adsorption and its effect on metal deposition reactions clearly remains to be established. However, in order to proceed to shape change simulations, simplification by way of chemical process models can be implemented as in the example that follows. 

In the SPS-PEG-C1 system the central role of the SPS-based catalyst is to open channels in the PEG-C1 blocking layer, thereby allowing the Cu2+/Cu+ reaction to proceed unhindered. This effectively accelerates the metal deposition reaction without requiring any change in the Cu2+/Cu reduction mechanism, that is, activation of a blocked electrode. Accelerated copper deposition occurs in the proximity of SPS adsorption sites. Chloride adsorbed in neighboring sites may also 

Chloride is known to form compact ordered monolayers on copper surfaces under open circuit conditions in simple halide solutions for example, c(2 x 2) Cl on Cu (100) [80, 134, 246, 247]. However, little is known about the adsorption geometry of the inhibiting PEG-C1 or the catalytic SPS-C1 complex, both highly topical questions for further research. 

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