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Free Solder Joint Reliability Trends

Lead-Free Solder Joint Reliability Trends [Pg.107]

Lead-Free Solder Joint Reliability Trends... [Pg.107]

J.P. Clech, Lead-Free and Mixed Assembly Solder Joint Reliability Trends, IPC Printed Circuits Expo Proc., 2004, p S28-3-1-S28-3-14... [Pg.105]

The topics discussed in the chapter cover the fundamental aspects such as the microstructure and mechanical/physical properties of Pb-free solder alloys, their processing issues (wetting behaviors, interfacial reactions, and joint defects), and their reliability issues (thermal fatigue, creep resistance, tin pest, and others). The existing and potential applications of each solder system for microelectronics have been extensively evaluated. In addition, the recent patent literature for Pb-free solders has been reviewed to discuss the trends in solder alloy development activities. [Pg.296]

See other pages where Free Solder Joint Reliability Trends is mentioned: [Pg.113]    [Pg.121]    [Pg.113]    [Pg.121]    [Pg.107]    [Pg.1373]    [Pg.12]   


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Lead-free solder joint reliability trends

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