Formulation of UV and EB Epoxy Adhesives

Radiation curing adhesives are generally applied as solvent-free liquids. High-solids EB and uv curing liquid adhesives have been formulated from a variety of resins and elastomers. They include epoxy acrylates, epoxies, other acrylates, polyesters, blends of acrylate monomers with elastomers, and other compositions. 

Free Radical Cure UV Adhesives. As with any adhesive, formulation variables are critical to the processing and performance characteristics. Variables such as oligomer selection, modifiers and additives, monomer structure, molecular weight, and glass transition temperature directly affect application and performance properties. 

Practical radiation curable materials are composed of more than a single reactive monomer. Commercial adhesives normally contain the following  

Examples of typical uv and EB coating compositions and their applications can be found in several sources.6,7,8 

UV and EB formulations consist primarily of oligomers, monomers, photoinitiators (in the case of uv or light cured adhesives) and crosslinking agents or accelerators (in the case of EB cured adhesives), and the other additives that would normally be expected in adhesive formulations. However, the effect of these additives on storage and processing conditions must be determined as well as the effect on cohesive and adhesive properties. Close attention needs to be paid to the photosensitive nature of these additives and to the conditions under which they are stored and used. 

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