Fabrication technology interfacial polymerization

Microelectronic device fabrication currently relies primarily upon photoresist processing for integrated circuit pattern delineation. Adhesion of polymeric photoresist patterns, especially those of micron and submicron dimensions, to the required fabrication substrates is of paramount importance. Photoresist image adhesion problems encountered in device fabrication have been solved by chemical interfacial treatments. Current new trends in microelectronic adhesion technology will be described and discussed with emphasis upon the chemical nature of the interface involved as determined by ESCA. 

Besides the synthesis of bulk polymers, microreactor technology is also used for more specialized polymerization applications such as the formation of polymer membranes or particles [119, 141-146] Bouqey et al. [142] synthesized monodisperse and size-controlled polymer particles from emulsions polymerization under UV irradiation in a microfluidic system. By incorporating a functional comonomer, polymer microparticles bearing reactive groups on their surface were obtained, which could be linked together to form polymer beads necklaces. The ability to confine and position the boundary between immiscible liquids inside microchannels was utilized by Beebe and coworkers [145] and Kitamori and coworkers [146] for the fabrication of semipermeable polyamide membranes in a microfluidic chip via interfacial polycondensation. 

---