Fabrication Technology for 2.5-D Systems

Cantilever on lower chip Contact stub from upper chip 

During the assembling process, a faulty die could be plugged and thus lead to accumulative yield loss. To counteract such yield loss, we envision the MEMS latch could support re-work to a certain extent. For instance, when a proper force in the opposite direction to the assembling process is exerted, the two assembled chips can be dissembled. The abilities of assemble and dissemble are critical, because otherwise it would be too expensive to build a 2.5-D system. 

---