Epoxies diamond-filled

Flexible, alumina-filled epoxy Flexible, diamond-filled epoxy Flexible, aluminum-nitride filled epoxy Thermally conductive epoxy Thermally conductive epoxy with color cure indicator... 

K would cause a AT of almost 100 °C. For at least two decades, alumina and crystaUine silica have been used to boost the thermal conductivity of epoxy resins. When highly conductive fillers such as boron nitride, aluminum niliide, and diamond powders become commercially available, these materials have been incorporated in adhesive compositions. The expected target was the attainment of kg values of at least 10 W m K if not better. Such high values have been claimed for diamond-filled adhesives but they remain currently questionable with regard to the experimental results. summarized in the graph of Fig. 12.18. 

Thermal-transfer adhesives that are electrically insulating also exhibit wide ranges of thermal conductivities, depending on the filler type and amount. The thermal conductivities of epoxies filled with boron nitride or diamond are approximately 4 W/m K and 12 W/m K, respectively, while those of the more common aluminum-oxide-filled adhesives range from 1 to 2 W/m K. 

Figure 20 Chemical formulae of the organic compounds used to prepare a two-part silver-filled epoxy adhesive and a series of polyimide adhesives loaded with aluminium, silver, gold, diamond, or aluminium nitride.

---