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Electronics solder reflow methods

The heat transfer mechanisms utilized for the mass reflow soldering of electronic assemblies include convection, radiation (infrared sources), and condensation (vapor phase). The most popular solder reflow method is based on forced convection. [Pg.539]

The requirements set out in the preceding section have to be satisfied by the individual process steps for the automated placement of electronic components on 3D-MID. The subsections below describe different methods for the individual process steps in reflow soldering of MID and discuss their suitability for MID. Necessary modifications to these processes are also explained. [Pg.118]

See other pages where Electronics solder reflow methods is mentioned: [Pg.423]    [Pg.19]    [Pg.20]    [Pg.21]    [Pg.292]    [Pg.425]    [Pg.429]    [Pg.430]    [Pg.438]    [Pg.656]    [Pg.1017]   
See also in sourсe #XX -- [ Pg.539 , Pg.540 , Pg.541 ]



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