Electron-hole transporter

Figure 20. Electronic structure and transport in mixed conducting perovskites. (a) Band picture of electronic structure in the high-temperature metallic phase of Lai- r tCo03-(5. (Reprinted with permission from ref 109. Copyright 1995 Elsevier.) (b) Localized picture of electron/ hole transport in semimetallic Lai- 3r Fe03-(5, involving hopping of electrons and/or electron holes (depending on the oxidation state of iron).

Electroluminescent polymeric 1,3,4-oxadiazole-containing agents, (IV), prepared by Roberts [3] were also effective as electron hole transport agents. 

Electron hole transport composites consisting of poly(aniline-co-2-acrylami-do-2-methyl-propanesulfonic acid), (V), and silicon nanoparticles were prepared by Hsu [4] and then used to prepare light-emitting diodes and electrodes for thin film field effect transistors. 

Thus, one will use some materials referred to as electron/hole transport layer (ETL/ HTL), which will be designed to exhibit a high electron/hole mobility, and accordingly electroluminescent material (EML), and electron/hole injection layer (EIL/HIL). 

We described the electron-hole transport in a superlattice along the superlattice axis (z) after the optical excitation within a semiclassical theory. We assumed... 

Eq. (16a) holds whether the electron/hole transport is via the conduction/valence band or via defect band hopping. 

Ihe Ught-to-electricity conversion efficiency or QE of hybrid solar cell is governed by the five basic steps involved in the process (Shown schematically in Figure 3.22) viz. light absorption by active material to form excitons (1), exciton diffusion toward interface (2), exciton dissociation at interface (3), free carriers (electron/hole) transport toward electrodes (4), and charge collection at respective electrodes (5) [178-180]. 

As in the case of polymers of the phenyl family, a great amount of work has been done concerning the introduction of electron/hole transporter molecules in the main conjugated backbone and by modifying the architecture of the devices [164-167]. Introduction of... 

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