Electromigration failure

Several approaches for enhancing the resistance to electromigration failure through microstructural control and design have been proposed. 

On the basis of experimental observations of electromigration failure in A1 interconnect lines, Black (1969) postulated a simple relationship for failure time tfaii in terms of current density, i, and temperature, T in the form... 

Figure 10.12 Electromigration Failures as a Function of Time ( Bathtub Curve). The Finished Parts are Tested and Those That Fail During Burn-in are Discarded and the Rest are Sold...

Electromigration failure in Pb-alloy solders can be classified in two ways (1) the mass transport of Pb or one of the major alloying elements in a solder alloy, such as Sn in a traditional eutectic... 

Electromigration Failure in Flip Chip Solder Joints... 

As discussed, flip-chip solder joints (Fig. 7) can be susceptible to electromigration failure because the relatively high diffusion coefficient of solder alloys enables significant diffusion at relatively... 

Yeh, E.C.C. Choi, W.J. Tu, K.N. Current-crowding-induced electromigration failure in flip chip solder joints. Appl. Phys. Lett. 2002, 80, 580-582. 

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