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Dispersoids solderability

High-Temperature Lead-Free Solders with Dispersoids... [Pg.301]

Incorporation of dispersoids has been pursued to improve the mechanical and, particularly, thermomechanical behavior of solders and their service-temjjerature capability without significantly altering the processing parameters [16-19]. This chapter addresses the role of dispersoids, their requirements, methods to incorporate them in a solder, and their influence on the microstructure and properties. Prior studies have dealt with several aspects of dispersoids in leadbearing solders, which will be briefly reviewed as they provide the basis for developments in lead-free solder systems. [Pg.302]

HIGH-TEMPERATURE LEAD-FREE SOLDERS WITH DISPERSOIDS... [Pg.303]

See other pages where Dispersoids solderability is mentioned: [Pg.108]    [Pg.110]    [Pg.303]    [Pg.303]    [Pg.304]    [Pg.308]    [Pg.309]    [Pg.309]    [Pg.309]    [Pg.310]    [Pg.310]    [Pg.310]    [Pg.310]    [Pg.320]    [Pg.320]    [Pg.327]    [Pg.328]   
See also in sourсe #XX -- [ Pg.325 ]



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Dispersoids

Dispersoids high-temperature lead-free solders with

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