Dielectrics, thick-film properties, desired

Dielectric and electronic thin film devices often need to have thickness over submicron so that they have desired properties or functions. Therefore, among the critical issues mentioned above, the requirement of cycled deposition is practically serious. Techniques that suppress cracking should be foimd, and more basically, understanding on crack formation and stress evolution in films should be obtained, which is still lacking in the present state. 

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