Devices photolithography

Microfabrication is growing in importance in a wide range of areas outside of microelectronics, including MEMS, microreactors, micro analytical systems and optical devices. Photolithography will continue as the dominant technology in the area of microelectronics for the foreseeable future. Photolithography has, however, a number of limitations for certain types of applications, as discussed in Sect. 3.1. 

Fig. 2. Outline of steps involved in the generation ot the silicon-wafer master mold and fabrication of microfluidic devices. Photolithography techniques are used to generate a silicon-water master mold patterned with the negative image of the desired microtluidic pattern. A PDMS mold is made trom the silicon-water mask and irreversibly bonded to a glass slide to generate a microtluidic tlow cell.

Applications microelectronics, optics, clear coatings, semiconductors, dielectric materials, release materials, fiber optics, impiantabie medical devices, photolithography ... 

Fabrication was done by photolithography and deep reactive ion etching (DRIB). The catalyst was inserted by sputtering. Such a prepared microstructure was sealed with a Pyrex cover. The bonded micro device was placed on a heating block containing four cartridge heaters. Five thermocouples monitored temperature on the back side. A stainless-steel clamp compressed the device with graphite sheets. 

FIGURE 10.4 Microphotograph of the pH ISFET with an on-chip pH meter. The whole device was coated with SU-8 photoresist using standard UV photolithography, leaving a 500 pm square well as the ISFET opening. (Reproduced from [85], with permission from Elsevier.)... 

The continual progress in VLSI device development is placing increasing demands on the lithographic technologies used for their manufacture. At the present time, almost all commercial devices are made by photolithography utilizing... 

Details of building specific types of microelectronic devices are well described by Grovenor15 as an illustration, we consider only the chemical techniques involved in making a metallic contact to a silicon wafer surface. Preparation of a wafer of Si or other material and application of epitaxial layers of semiconducting or insulating materials, if required, were outlined in Section 19.2.1. The construction of shaped features on the wafer is usually done by photolithography, or ion- or electron-beam variants thereof. 

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