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Design Multilayer issues

Chapters 10 and 11). Current distribution during deposition and both in situ and ex situ deposit characterization are the focus of Chapters 12-14. Electronic design (mathematical modeling) is the subject of Chapter 15, followed by the issues of structure, properties of deposits, multilayers, and interdiffusion (Chapters 16-18). [Pg.388]

For LB multilayers, the main issue is the control of film symmetry through deposition characteristics. Polar alignment can be achieved through molecular design and synthesis. [Pg.328]

HDI and microvias place a new bnrden on printed circuit design. The various IPC types impose significant changes in the multilayer stack-up from a conventional board. But additionally, microvias can be implemented in many different ways and with different design rules. This section presents just a few of the design issues. [Pg.479]

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See also in sourсe #XX -- [ Pg.2 , Pg.3 , Pg.4 , Pg.5 , Pg.6 , Pg.7 , Pg.8 , Pg.9 , Pg.10 , Pg.11 , Pg.12 , Pg.13 , Pg.14 , Pg.15 , Pg.16 , Pg.17 , Pg.21 ]



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