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Crack wake interaction

To achieve increased crack deflection and crack-wake interaction in SiC the microstructure can be modified in various ways ... [Pg.710]

Tensile fracture in SiC-based composites will only occur after a large enough load is applied to exceed the compressive stress in the process zone formed along the crack path. In order to achieve an increased crack deflection and crack-wake interaction in SiC, the microstructure can be modified in various ways ... [Pg.162]

It is well known that crack propagation properties are related to bridging effect and this effect is more pronounced in coarse-grained materials [24 27]. Coarse-grain alumina shows an R-curve behavior which is characterized by an increase in crack resistance with crack extension, due to crack surface interaction in the crack wake [28 29]. This R-curve behavior is due to the stresses required to overcome the traction of interlocking grains and pullout of unbroken ligaments in the wake of the crack. [Pg.521]


See other pages where Crack wake interaction is mentioned: [Pg.79]    [Pg.308]    [Pg.609]    [Pg.611]    [Pg.675]    [Pg.190]    [Pg.29]    [Pg.31]   
See also in sourсe #XX -- [ Pg.163 ]




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