Copper foil Peel strength

Adhesives in electrical applications involve laminates with metal substrates and often have to withstand high temperatures. The laminates are often fairly thin and reasonably flexible therefore fixed arm and T-peel procedures can be helpful in measuring their adhesive strength. For example, a BMI system was bound to copper foil of thickness 25 pm. Some fixed arm (where the base plate formed a bond with aluminium) and T-peel results for this system are summarised in Table 2 on 15 mm width specimens of length 150 mm. 

Polyimides are used in the construction of multilayer printed circuit boards because of their low coefficient of thermal expansion, high bond strength/peel strength of copper foil at elevated temperature, and no resin smear. 

---