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Composition of Epoxy Adhesives

It is not the intention of this book to review the complex chemistry associated with these products or to review information other than the analysis for metallic type agents that are critical to these formulations. The metallic additives need to be monitored as part of quality assurance and for environmental and health requirements. [Pg.187]

2 Preparation of Epoxy Adhesive Spiked with Ge(AcAc)BF4 [Pg.187]

There are many metal-type additives in epoxy adhesives and for the sake of analytical input to these products for metal content the following formulations were prepared to study the effect of different sample preparation methods as applied to these products. Four typical epoxy formulations containing active monomer/resin, colorants, curatives and fillers were prepared in the laboratory as part of a study of sample preparation methods for the determination of the concentration of the Ge(AcAc)BF4 additive. The four preparations were formulated as shown in Table 6.14. [Pg.187]

Each of the formulations (Table 6.14) contains 0.1% Ge(AcAC)BF4 which equates to 279 ppm germanium and 42 ppm boron, respectively. Both elements can be used to quantify the concentration of this curative and the laboratory prepared samples using a high shear mixer for 3 h to ensure homogenous products. [Pg.187]


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