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Electroplating onto composite films

The final bulk resistivity was 7.8 x 10 " ohm-cm and 6.750 x 10 " ohm-cm for copper-containing and silver-containing films, respectively, taking the total thickness into account for calculation. The copper was then electroplated onto the composition-ungraded plasma film. [Pg.456]

See other pages where Electroplating onto composite films is mentioned: [Pg.1061]    [Pg.1061]    [Pg.188]    [Pg.4208]    [Pg.322]    [Pg.331]    [Pg.320]    [Pg.331]   
See also in sourсe #XX -- [ Pg.454 , Pg.456 ]



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