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Chemical vapour deposition

The chemical vapour deposition is discussed here as Metalorganic vapour phase epitaxy and Electrostatic spray assisted vapour deposition. [Pg.185]

Electrostatic spray assisted vapoin deposition (ESAVD) is a technique to deposit both thin and thick layers of a coating on to various substrates. In simple terms when chemical precursors are sprayed across an electrostatic field towards a heated substrate, the chemicals imdergo a controlled chemical reaction and are deposited on the substrate as the required coating. Electrostatic spraying techniques were developed in the 1950s for the spraying of ionized particles on charged or heated substrates. [Pg.185]

ESAVD (branded by IMPT as Layatec) is used for various applications in many markets including  [Pg.185]

Some kinetic considerations of chemical vapour deposition processes Ch. 17 [Pg.596]

The apparatus can be thought of as being made up of three main constituent parts—precursor handling, the reactor, and the exhaust of by-products. [Pg.597]

The reactor is the heart of any CVD system and, in common with other [Pg.597]

The gaseous by-products from a CVD reactor can often have unpleasant [Pg.599]

This method is very important in the preparation of high-purity thin films and coatings it consists in the decomposition of gaseous species (the precursor molecules) and the consequent deposition of the products on a suitable object. The decomposition in the gas phase may be induced by heat or, for instance, by irradiation. The precursor may be a simple molecule, as in the deposition of an element (for instance Si or Ge) from their hydrides, or a mixture of different molecules (Cr from CrCl2 + H2 Si02 from Si(CH2CH3)4 + 02 of air GaAs as described in 6.12). [Pg.583]

An interesting application of this method is the preparation of diamond films which may be obtained from a precursor such as CH4, C2H2 and H2 activated by heating, microwaves, etc. typically at 600-1000°C at a reduced pressure. The direct deposition from the gas to the surface results in the formation of metastable diamond whereas, according to the phase diagram (see Fig. 5.37), the production of stable bulk diamond requires very high pressure and temperature. Kinetically, the [Pg.583]

Diamond coatings as bulk diamonds may have important applications due to the unique properties of this substance (high hardness, low thermal expansion, high-thermal conductivity). [Pg.584]


In practical applications, gas-surface etching reactions are carried out in plasma reactors over the approximate pressure range 10 -1 Torr, and deposition reactions are carried out by molecular beam epitaxy (MBE) in ultrahigh vacuum (UHV below 10 Torr) or by chemical vapour deposition (CVD) in the approximate range 10 -10 Torr. These applied processes can be quite complex, and key individual reaction rate constants are needed as input for modelling and simulation studies—and ultimately for optimization—of the overall processes. [Pg.2926]

Molecular dissociation and chain reactions in chemical vapour deposition... [Pg.62]

Chemical vapour deposition Example. The preparation of films of titanium dioxide. [Pg.235]

Polymer-metal fractal interfaces may result from processes such as vacuum deposition and chemical vapour deposition where metal atoms can diffuse con-... [Pg.337]

An MWCNT has inner concentric tube(s) with smaller diameter(s) inside its hollow, and it is normally prepared in the carbon electrode of the arc-discharging method or by chemical vapour deposition method (see Chaps. 2 and 12). Influence of such inner tubes on the most outer layer in MWCNT is of interest with respect to electronic similarity of MWCNT and SWCNT. [Pg.47]

The alkoxides and aryloxides, particularly of yttrium have excited recent interest. This is because of their potential use in the production of electronic and ceramic materials,in particular high temperature superconductors, by the deposition of pure oxides (metallo-organic chemical vapour deposition, MOCVD). They are moisture sensitive but mostly polymeric and involatile and so attempts have been made to inhibit polymerization and produce the required volatility by using bulky alkoxide ligands. M(OR)3, R = 2,6-di-terr-butyl-4-methylphenoxide, are indeed 3-coordinate (pyramidal) monomers but still not sufficiently volatile. More success has been achieved with fluorinated alkoxides, prepared by reacting the parent alcohols with the metal tris-(bis-trimethylsilylamides) ... [Pg.951]

Molybdenum is used for high energy laser mirrors which require water cooling. Corrosive action of the circulating cooling water can be prevented by coating the waterways with a thin film of tungsten by chemical vapour deposition. US Pat Application 308976 (1982). [Pg.850]

Chemical vapour deposition (CVD) Chemical reaction causing gaseous M, compound to split up and release M, to deposit on M2 Healed Mj Igas solid 2 M, Cr M2 Fe... [Pg.434]

Ion Vapour Deposition A variant of the process is ion vapour deposition, in which a high negative potential is applied to the workpiece during chemical vapour deposition. The process has been employed on a commercial scale chiefly for depositing aluminium on to steel and titanium in the aerospace industry as an alternative to cadmium plating, which is liable to cause hydrogen embrittlement, especially of high tensile steel components. The aluminium is evaporated from a wire-fed resistance-heated boat . [Pg.444]

The largest uses of platinum group metals in electronics are ruthenium for resistors and palladium for multilayer capacitors, both applied by thick film techniques . Most anodes for brine electrolysis are coated with mixed ruthenium and titanium oxide by thermal decomposition . Chemical vapour deposition of ruthenium was patented for use on cutting tools . [Pg.566]

Compounds like ds-[PdMe2(PR3)2] (R = Me, Et) have been suggested as chemical vapour deposition (CVD) precursors for palladium [108b]. [Pg.222]

Aylett, B. J., and Tannahill, A. A., Chemical Vapour Deposition of Metal Silicides from Organometallic Compounds with Silicon-Metal Bonds, SIRA Int. Seminar on Thin Film Preparation and Processing Technolgy, Brighton, UK (March 1985)... [Pg.341]

Verheijen, J., Bongaerts, P., and Verspui, G., Low Pressure Chemical Vapour Deposition of Temperature Resistance Colour Filters, Proc. 10th. Int. Conf. on CVD, (G. Cullen, ed.), pp. 977-981, Electrochem. Soc., Pennington, NJ 08534 (1987)... [Pg.424]

Oguri, K. and Ariai, T., Friction Coefficient of Si-C, Ti-C and Ge-C Coatings with Excess Carbon Formed by Plasma-assisted Chemical Vapour Deposition, Thin Solid Films, Vol. 208,1992, pp. 158-160. [Pg.162]

Diamond was doped by chemical vapour deposition to levels of 1019-1021/cm3. A bias was applied to achieve efficient extraction of the secondary B ions, and these were detected to map out the variation of B concentration from one area to another, as illustrated in Figure 4.7. [Pg.80]

An example of this process of data analysis is provided by the work of Yubero et al. (2000), who studied the structure of iron oxide thin films prepared at room temperature by ion beam induced chemical vapour deposition. Such films find important applications because of their optical, magnetic, or magneto-optical properties. They were produced by bombardment of a substrate with Oj or Oj + Ar+ mixtures, and Figure 4.15 shows RBS spectra of two iron oxide thin films prepared on a Si substrate by each of these bombardment methods. [Pg.94]

Baum, T. H. Larson, C. E. Ligand Stabilised +1 Metal /3-diketonate Coordination Complexes and their Use in Chemical Vapour Deposition of Metal Thin Films. U.S. Patent 5,096,737, March 17, 1992. [Pg.1103]

Kuppers, D., and Lydtin, H. Preparation of Optical Waveguides with the Aid of Plasma-Activated Chemical Vapour Deposition at Low Pressures. 89, 107-131 (1980). [Pg.166]

The industrial application of Plasma Induced Chemical Vapour Deposition (PICVD) of amorphous and microcrystalline silicon films has led to extensive studies of gas phase and surface processes connected with the deposition process. We are investigating the time response of the concentration of species involved in the deposition process, namely SiH4, Si2H6, and H2 by relaxation mass spectroscopy and SiH2 by laser induced fluorescence. [Pg.337]


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