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Thermal conductivity ceramics

Fig. 5.26 Multilayer ceramic thermal conduction module (a) underside showing connector pads - substrate size 90 x 90 x 6 mm (b) multilayer construction (c) silicon chip mounting positions (d) schematic diagram illustrating buried interconnections (e) thermal conduction module. (Courtesy of IBM Corp., East Fishkill.)... Fig. 5.26 Multilayer ceramic thermal conduction module (a) underside showing connector pads - substrate size 90 x 90 x 6 mm (b) multilayer construction (c) silicon chip mounting positions (d) schematic diagram illustrating buried interconnections (e) thermal conduction module. (Courtesy of IBM Corp., East Fishkill.)...
FIGURE 1.1.4 Thermal resistance as a function of ceramic thermal conductivity. [Pg.7]

Sintered ceramics (thermal conductivity below 2 W/mK) for nozzle and manifold spacer pads. [Pg.81]

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See also in sourсe #XX -- [ Pg.212 ]

See also in sourсe #XX -- [ Pg.209 ]

See also in sourсe #XX -- [ Pg.224 ]



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