Bonding of Fused Quartz Chips

Etch Conditions Etch Depth Wet HF Etch References 

BOE represents buffered oxide etch with various ratios of 40% NH4F/49% HF. 

FIGURE 2.11 Electron micrograph of the cleaved edge of a quartz chip showing the channel cross section [1006]. Reprinted with permission from the American Chemical Society. 

In one report, no bonding plate was needed to create the sealed quartz channels. These were achieved by first depositing a layer of poly-Si the quartz substrate, which was then wet etched through a tiny hole to create a quartz channel and a thin Si02 roof [154], 

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